au.\*:("BLODGETT AJ")
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THERMAL CONDUCTION MODULE: A HIGH-PERFORMANCE MULTILAYER CERAMIC PACKAGEBLODGETT AJ; BARBOUR DR.1982; IBM J. RES. DEVELOP.; ISSN 0018-8646; USA; DA. 1982; VOL. 26; NO 1; PP. 30-36; BIBL. 9 REF.Article
